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Semiconductor industry

Sputter targets, high-purity SiC, CVD coatings, functional ceramics

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Spark Plasma sintering systems

Type HP D / H-HP D

With the help of this series of systems, materials can be compacted in the shortest possible time using direct current (pulsed direct current) and/or additionally with radial heating. The material systems used here are virtually unlimited.

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Uniaxial hot press

Type HP W - resistance heated

Hot presses are suitable for safely compacting a variety of different materials.

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CVD / CVI

Type CVD / CVI - systems for coating / infiltration from the gas phase

CVD systems enable the deposition of various layers (e.g. SiC, pyrolytic BN (PBN), pyrolytic carbon (PyC)) with the highest purities and densities.

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Gas pressure sintering furnaces

Type FP W - resistance heated

Gas pressure sintering systems are suitable for maximising the compression of two-phase material systems such as Si3N4, SIALONE, AlN or mixed ceramics using overpressure (up to 10 MPa). In addition, such gas pressure sintering systems are also used for synthesis processes in order to influence the chemical equilibrium in a targeted manner using overpressure.

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