Deutsch 
English 
中文 
Semiconductor industry
Sputter targets, high-purity SiC, CVD coatings, functional ceramics
Spark Plasma sintering systems
Type HP D / H-HP D
With the help of this series of systems, materials can be compacted in the shortest possible time using direct current (pulsed direct current) and/or additionally with radial heating. The material systems used here are virtually unlimited.
Uniaxial hot press
Type HP W - resistance heated
Hot presses are suitable for safely compacting a variety of different materials.
CVD / CVI
Type CVD / CVI - systems for coating / infiltration from the gas phase
CVD systems enable the deposition of various layers (e.g. SiC, pyrolytic BN (PBN), pyrolytic carbon (PyC)) with the highest purities and densities.
Gas pressure sintering furnaces
Type FP W - resistance heated
Gas pressure sintering systems are suitable for maximising the compression of two-phase material systems such as Si3N4, SIALONE, AlN or mixed ceramics using overpressure (up to 10 MPa). In addition, such gas pressure sintering systems are also used for synthesis processes in order to influence the chemical equilibrium in a targeted manner using overpressure.
